BGA stands for Ball Grid Array. We have been providing BGA assembly services including BGA Soldering service, BGA Reballing Service, and BGA Rework Service in the Printed Circuit Board Assembly industry for many years.Get instant quote
BGA stands for Ball Grid Array. We have been providing BGA assembly services including BGA Soldering service, BGA Reballing Service, and BGA Rework Service in the Printed Circuit Board Assembly industry for many years. With the most advanced BGA placement equipment, high-precision BGA assembly processes, HD X-ray Inspection equipment, and highly customizable Turnkey PCB Assembly solutions, you can rely on us to produce high yield BGA PCB Assemblies with high quality.
Our SMT manufacturing team has rich experience in handling all types of BGAs and have excellent capacity to place them onto your PCB boards with good connection and appearance. Read on to more about our BGA Assembly Capacity as following:
Hereafter contents is helpful to know how to do BGA Assembly Process. Thermal profile, meaning temperature control, which is the most important for BGA in the PCB Assembly process. Our SMT production team will conduct a careful DGM Check to review your PCB Gerber files and the BGA datasheet to optimize the thermal profile for the BGA assembly. Taking BGA size and BGA ball material composition type into consideration, then to make effective temperature control. If the BGA size is large, we will optimize the thermal profile localize the heating on the internal BGA to prevent joint voids and other Common PCB Assembly Faults. We follow the IPC Class 2 or Class 3 Quality Management guidelines to make sure any voids are under 25% of the total solder ball diameter. BGAs will go through a specialized lead-free thermal profile to avoid open ball problems that can result from the lower temperatures, and to prevent higher temperatures from causing pin shorts.
When we receive your Turnkey PCB Assembly Order, we will check your PCB design to review any considerations specific to BGA components during DFM (Design for Manufacturability) review. The full verification includes checks for the PCB Laminate Material compatibility, Surface Finish effects, maximum warpage requirement and Soldermask clearance. All these factors affect the quality of BGA assembly.
Your PCB design may only have a few BGAs or fine pitch components which require PCB Assembly Prototyping for research and development purpose. We can help in this stage, and we provide specialized BGA soldering service for testing and evaluation purposes because it is a part of our focus on Prototype PCB Assembly. What’s more, we can do actual assistance with BGA reballing and BGA rework at low cost. If your BGA component on PCBA goes something problem, we can conduct the BGA rework following such 5 basic steps: BGA component removal, SMT pads preparation, solder paste application through a small BGA stencil, BGA replacement, and Reflow Soldering.
X-ray inspection is the best method to detect BGA assembly defects. Though X-ray inspection, we can eliminate soldering problems on PCB board, such as Solder Balls and Paste Bridging. Also, the X-ray support software can calculate the gap size in the ball to make sure it follows IPC class 2 or Class 3 standards, as per your requirement. If in demand, we can send you the X-ray inspection photos.